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Non-oxidizing atmosphere constant temperature chamber 'IPHH-202M/IPHH-202MS'

Supports more precise atmosphere control! Ensures worker safety while reducing process time.

We would like to introduce our oxygen-free atmosphere constant temperature chamber, the 'IPHH-202M/IPHH-202MS'. The standard "IPHH-202" has been customized for the semiconductor industry, incorporating the necessary functions for low-oxygen annealing in the production process. It can stably perform high-temperature heat treatment up to 300°C in an extremely low-oxygen environment with an oxygen concentration of 100 ppm or less. 【Features】 ■ Heating starts after reaching a low-oxygen state to prevent oxidation of the workpiece. ■ Once the set oxygen concentration is reached, nitrogen flow is reduced to contribute to energy savings. ■ Two systems for nitrogen gas introduction: large and small. ■ External air is supplied to the lower part of the inner chamber floor for heat exchange through indirect air cooling. ■ The low-oxygen state within the chamber is maintained while significantly reducing temperature drop time. ■ Compressed air is introduced at the end of the program to quickly restore the oxygen concentration in the furnace. *For more details, please download the PDF or feel free to contact us.